由电子轰积致的电导 bombardment induced conductivity
电子轰击 bombardment of electrons
轰击 bombardment?
结合损坏 bond failure
焊接界面 bond interface
键合处剥离 bond lift off
焊盘图象形成 bond pad definition
键合牵引试验 bond pull test
键合工序 bond sequence
粘合强度 bond strength?
热压焊接机 bonder
焊接颇毛细管 bonder capillary
电子轰击 bombardment of electrons
轰击 bombardment?
结合损坏 bond failure
焊接界面 bond interface
键合处剥离 bond lift off
焊盘图象形成 bond pad definition
键合牵引试验 bond pull test
键合工序 bond sequence
粘合强度 bond strength?
热压焊接机 bonder
焊接颇毛细管 bonder capillary
芯片键合用粘合剂 bonding adhesive
焊接区 bonding area?
焊接周期 bonding cycle
焊接夹具 bonding fixture?
粘合层 bonding layer
焊接引线 bonding lead
焊盘 bonding pad
焊接速率 bonding speed
焊接技术 bonding technique?
焊头 bonding tip
焊线 bonding wire
焊线连接 bonding wire connection
焊接 bonding?
辅助放大器 booster amplifier
升压二极管 booster diode
增压泵 booster pump?
辅助发射机 booster transmitter
光放大器 booster?
自益放大器 bootstrap amplifier
自举电路 bootstrap circuit
掺硼基极 boron base
掺硼耗尽 boron depletion
硼扩散 boron diffusion
掺硼 boron doping
硼离子注入 boron implantation
注硼硅 boron implanted silicon
氮化硼薄膜 boron nitride pellicle
掺硼半导体 boron semiconductor
硼 boron?
硼硅玻璃 borosilicate glass